A new phase change tape extends the line of Thermacool thermal management products for the computer assembly market. Provides high thermal transfer between microelectronic components on circuit boards and heat sinks, allowing the replacement of thermal grease in rapid microelectronic assembly operations.

Available in many customized die cut formats for a range of applications.

The new line of phase change products include:

• C1055, with very high thermal conductivity; has been specified in many high performance processor applications.
• C1060, which has an integral reinforcement to provide more robust handling.
• C1095X01 thermally conductive polymeric interface material designed to avoid bondline adhesion between heat sink and the microprocessor metal surface for rework.
• C1100 phase change compound with room temperature self-adhering-properties and improved heat transfer that is said to rival the best thermal grease.

www.fff.saint-gobain.com

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