Magnalytix introduced its MGX Mixed Technology SIR Test Board, designed for SIR testing and electronics reliability characterization across mixed-component assemblies. The double-sided board features four channels per side and combines fine-pitch, bottom-terminated, through-hole, and passive components into a single standardized platform. Supports cleanliness testing and reliability characterization aligned with J-STD-001 Section 8 requirements. Intended to evaluate flux behavior, assess cleaning effectiveness and measure process robustness across a range of component geometries and electrochemical risk conditions.
Göpel electronic expanded its Multibus Controller 6281 platform with support for up to eight independent 10BASE-T1S automotive ethernet interfaces for parallel ECU communication testing. Adds 10BASE-T1S capability alongside existing support for 100BASE-T1 and 1000BASE-T1, enabling the 62 Series to support multiple automotive communication technologies within a single hardware platform. The system is designed for ECU testing, communication analysis and rest bus simulation applications across automotive electronics environments. Allows simultaneous parallel testing of up to eight devices under test (DUTs), The Multibus Controller 6281 also includes eight digital I/O interfaces consisting of four digital inputs and four digital outputs.
KashTech TrackMate manufacturing software platform, designed for SMT electronics manufacturing environments, provides real-time production visibility, traceability, and analytics across production lines, machines, and operators. Features end-to-end SMT line tracking, KPI dashboards for yield, downtime, and throughput monitoring, and configurable alerts for identifying production bottlenecks. Supports integration with ERP platforms including Odoo and is designed to improve equipment utilization, reduce downtime, and increase manufacturing efficiency through real-time analytics and automation.
Samtec mPOWER ultra micro connector system, now available with through-hole PCB termination options, is designed for enhanced mechanical strength and reliability in industrial, military, and aerospace applications. Available for UMPS and UMPT vertical board connectors and UMPT-RA right-angle board connectors. Supports up to 18A per power blade while reducing board space requirements by 40% compared with conventional power connectors. Supports board-to-board, wire-to-board, and wire-to-wire applications with vertical and right-angle configurations, stack heights from 5mm to 20mm, rugged latching features, and 2 to 10 power positions. PVC and Teflon fluoropolymer cable assembly options available in multiple wire gauges.
Tagarno relaunched its Full HD digital microscope line with updated configurations, revised model structure and a new camera system for inspection applications. Now centers on the ZIP+, ZAP+, and TREND+ models, with MOVE and FRONT integrated as configurations within the ZAP+ platform and the Prestige model discontinued. The microscopes incorporate a Sony FCB-EV9520L camera, providing improved dynamic range, reduced image noise,and updated color reproduction for inspection of reflective and fine-detail surfaces such as solder joints. Supports simultaneous zoom and focus adjustments, along with faster image processing for navigation and inspection tasks.
Low-silver wire solder series supports manual and automated soldering applications with reduced silver dependency. The system features 0.1–0.3% Ag content and anti-iron tip erosion properties to extend soldering tip life. Designed to support improved wettability and solder flow, with reduced bridging under challenging conditions. Flux system enables consistent coverage with residues designed for simplified cleaning. Suitable for robotic soldering applications and integration into automated assembly processes. Intended for electronics manufacturing environments seeking cost control while maintaining process stability.