Traction-grade DC filtering capacitors support high-power applications in electric vehicles and industrial systems. The FFLK series uses metallized polypropylene film to enable high current handling, low ESR and long operating life in compact cylindrical form factors. Designed for demanding environments, the capacitors support applications exposed to high temperature, vibration and electrical stress, including motor drives and traction systems.
Selective soldering platform supports through-hole PCB assembly in batch and in-line configurations. The PHOENIX system provides automated flux application, precision solder control and software-driven process management through EmberX, enabling consistent and repeatable soldering results. Designed for integration into production environments, the platform supports reliable operation and streamlined workflows for electronics assembly applications. Systems are backed by established selective soldering expertise and support infrastructure for ongoing production needs.
Agentic AI platform integrates with manufacturing execution systems to automate reporting, support, modelling and code generation in semiconductor and electronics factories. FabOrchestrator layers large language model capabilities onto MES platforms, enabling engineers to query production data in natural language, streamline support ticket handling and accelerate system configuration and implementation. The platform includes tools for data analysis, automated troubleshooting, system modelling guidance and back-end code generation, supporting more efficient use of factory data and reducing engineering workload.
High-power chip resistors with aluminum nitride substrates support thermally constrained electronics applications. The RMAN series uses aluminum nitride to enable higher thermal conductivity than standard alumina, allowing improved heat dissipation, lower operating temperatures and stable electrical performance. Designed for power-dense environments, the resistors support applications including IGBT, SiC and GaN modules, power supplies, EV systems and RF circuits. Devices deliver power ratings up to 2.4W in 1206 and 3.4W in 2512 packages while maintaining controlled hotspot temperatures.
AI-driven probe inspection system automates ICT fixture verification in electronics manufacturing. The system uses high-resolution imaging, synchronized lighting and adaptive AI to analyze probe marks across the PCB, verifying contact accuracy and detecting misalignment, insufficient contact and early probe wear. Supports high-density and fine-pitch designs with approximately 7µm resolution and offers single-sided and dual-sided inspection. Generates detailed inspection reports with probe position data, deviation analysis and visual records to support traceability and process control. Available in automated, benchtop and service-based configurations for production, validation and development environments.
Custom SMT nozzle supports accurate placement of terminal-style connector components on Yamaha I-Pulse platforms. Features an angled 4.66mm x 10mm vacuum design engineered to improve pick-and-place alignment for challenging geometries, including Degson terminals. The nozzle addresses handling and orientation issues commonly associated with terminal components. Designed for use with Yamaha I-Pulse M20 bases, the configuration supports applications requiring precise component positioning across a range of SMT processes.
