Custom Samsung nozzle (Part #2026-5654) supports placement of LiteOn TLMH4TGVADA LEDs on Samsung CP45 and SM10–SM421 pick-and-place platforms. Design incorporates a Samsung-style nozzle base with a standard reflector size for machine recognition and a precision plastic tip measuring 4.50mm × 4.50mm to match the LED package geometry. Tip construction is intended to maintain stable vacuum pickup while protecting sensitive LED surfaces during high-speed SMT placement. Component is designed for application-specific SMT assembly where nonstandard component shapes require specialized nozzle tooling.
MCJ Series surface-mount jumper chip resistors use a solid metal element construction to provide low resistance and higher current capacity in standard chip sizes. Supports current ratings from 8A in 0201 packages to 122A in 2512 sizes, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited to lower current levels. Available in chip sizes 0201, 0402, 0805, 1206 and 2512. Sizes 0402, 0603 and 0805 are AEC compliant for automotive applications.
SolderKing released SAC0307, a low-silver alloy option within its SK P2-5 solder paste family designed to support flexible alloy selection while maintaining the same established flux chemistry and process settings. The paste enables manufacturers to evaluate alternative alloy compositions without modifying existing production parameters. Designed for surface-mount assembly applications requiring reliable stencil printing and consistent wetting across common PCB finishes including OSP, ENIG, immersion silver, tin and HASL. The flux formulation is designed to reduce voiding and head-in-pillow defects while leaving minimal residue after reflow. The material complies with J-STD-004B and Bellcore ECM requirements. Available in Type 4 (20–38µm) and Type 5 (15–25µm) powder grades to support fine-pitch and high-density assemblies. Extended tack and open times exceeding three days provide flexibility for longer production runs or staged builds, while a 12-month refrigerated shelf life supports material inventory management.
SolderKing Assembly Materials
OE in a Box packages the key materials required to generate IPC J-STD-001 objective evidence reports for electronics manufacturing reliability validation. Kit includes B-52 Legacy 2 test cards, taped components, a stencil offering from Metal Etch Services, ESD bags and other materials needed to perform surface insulation resistance (SIR) testing preparation. Simplifies the process by shipping all required items in a single kit with return logistics so manufacturers can quickly send completed boards to Magnalytix for third-party testing and validation reports. Platform is designed to accelerate reliability verification, support compliance documentation and streamline testing workflows.
TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.
630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.
Press Releases
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- Hon Hai Technology Group (Foxconn) Commits To New 5-Year Sustainability Roadmap Through 2030