Low-silver wire solder series supports manual and automated soldering applications with reduced silver dependency. The system features 0.1–0.3% Ag content and anti-iron tip erosion properties to extend soldering tip life. Designed to support improved wettability and solder flow, with reduced bridging under challenging conditions. Flux system enables consistent coverage with residues designed for simplified cleaning. Suitable for robotic soldering applications and integration into automated assembly processes. Intended for electronics manufacturing environments seeking cost control while maintaining process stability.
Low-silver solder paste series supports SMT assembly with reduced material cost exposure while maintaining process compatibility. The system features ~0.1–1.1% Ag content compared to ~3.0% in SAC305, enabling lower silver usage. Designed for compatibility with standard SAC305 reflow profiles, minimizing requalification requirements in existing processes. Supports stable wetting performance and controlled voiding behavior, with reliability validated through thermal cycling and mechanical testing. Intended for cost-sensitive SMT applications requiring consistent process performance and long-term reliability.
Wafer inspection and metrology platform supports advanced packaging and back-end semiconductor processes. The system accommodates 6" to 12" wafers and integrates automated visual inspection for detection of particles, scratches, chipping, contamination and foreign materials. Granite-based structure supports system stability, with optional short-wave infrared module enabling detection of subsurface defects within silicon. 3D depth-from-focus module offers imaging at 0.5µm or 1µm resolution for detailed surface analysis. Platform performs metrology for wafer thickness, top-side warpage and surface topography, along with measurement of through-silicon via depth, trench dimensions, thin films and chiplet features. Designed for inspection and measurement applications across advanced packaging workflows.
Collaborative robot supports flexible automation across high-mix, low-volume manufacturing environments. The system offers a 3kg payload and weighs 24lbs, enabling manual repositioning and rapid redeployment between workstations without fixed installation. Designed for applications including welding, part handling, screwdriving, small assembly and inspection. Compact form factor supports use in constrained spaces, with mounting options including floor, wall and ceiling configurations. Part of the CRX platform with expanded capabilities such as dual nut runner operation, high inertia mode for assisted heavy movement and enhanced palletizing support up to 40kg on larger models. Compatible with R-50iA controller, supporting Python scripting, ROS 2 integration and AI-driven motion applications.
Ultrafast rectifiers support power conversion and protection applications across automotive, industrial and electronics systems. The 200V devices provide current ratings from 6A to 15A and are offered in single and dual configurations, including AEC-Q101 qualified versions. Housed in a 6.5mm x 4.6mm DFN6546A package with a 0.88mm profile, enabling compact PCB layouts. Optimized copper mass design and die placement support thermal performance for higher current operation, while wettable flanks enable AOI inspection without X-ray. Operate from -55°C to +175°C and feature low forward voltage drop of 0.75V, fast reverse recovery and low reverse recovery charge to reduce power losses. Applications include inverters, DC/DC converters, freewheeling diodes, protection circuits and automotive systems such as ECUs, ADAS and battery management.
Incoming inspection platform supports traceability and material verification in electronics manufacturing. The MODI WES 5 uses high-resolution imaging to capture and verify component data at receipt, including barcode reading and label analysis. The system records key information to support full traceability from incoming materials through production. Integrates with ERP and MES systems to maintain data continuity across manufacturing workflows. Automated inspection reduces manual errors, improves receiving speed and enhances inventory accuracy. Designed for production environments, the system supports material tracking, documentation and process control before assembly operations begin.
