Master Bond’s Supreme 10HTLV is a one-part, heat-cured epoxy. The non-frozen system features a moderately high viscosity with good flow characteristics and does not thicken over time. Supreme 10HTLV offers unlimited working life at room temperature and requires no mixing. The epoxy delivers high mechanical strength, achieving tensile shear strengths exceeding 3,600psi and T-peel strengths up to 30pli. The system withstands cryogenic temperatures down to 4K and remains serviceable up to 400°F. Survives 1,000 hours at 85°C/85% relative humidity. The epoxy also resists water, oils and a wide range of chemicals. Supreme 10HTLV is electrically insulative, with a volume resistivity greater than 10¹²ohm-cm at room temperature, and bonds effectively to metals, glass, ceramics and many plastics. It offers flexible heat-curing profiles, including 60–75 minutes at 250°F or 35–40 minutes at 300°F.

Heraeus Electronics’ mAgic® PE360 is a silver sintering material developed for large-area power module attachment applications requiring high thermal and mechanical performance. The material enables uniform bond lines and low voiding. mAgic® PE360 sinters at relatively low pressure and temperature. The material is available in both printing (PE360P) and dispensing (PE361D) formats.

Hirose's 1.0mm coaxial connector designed for high-frequency applications up to 110GHz. The connector complies with IEEE Std 287 and is engineered to support advanced RF and microwave designs. Features a compression-mount center contact that accommodates a range of PCB thicknesses, from under 1mm to several millimeters. With voltage standing wave ratio (VSWR) values of 1.8 maximum from 0–67GHz and 1.9 maximum from 67–110GHz. These characteristics support applications where signal integrity and low insertion loss are critical.

ASMPT Siplace V placement platform has a new machine frame and efficient linear drives and measuring systems with increased resolution.