Indium3.1 water-soluble Pb-free solder paste is formulated for fine-pitch applications.  The company claims the long stencil life virtually eliminates solder paste waste.

Said to exhibit excellent wetting under both air and nitrogen reflow atmosphere. Residue is easily cleaned with water.

Features a wide reflow window, slump resistance, low voiding and low foaming. 

www.indium.com

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