Indium Debuts Water-Soluble Pb-Free Paste
Published: 29 November 2004
by Staff
Indium 3.1 water-soluble lead-free solder paste is said to offer excellent wetting and printing for fine-pitch applications, and a long stencil life that virtually eliminates solder paste waste. Resultant sodler joints are shiny and smooth. Also claims a wide reflow window, slump resistance, low voiding and low foaming.
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