Version 5 of the Web-based Flopack software enables the creation of Delphi compact models that predict the performance of electronic components under soon-to-be-published thermal testing standards from JEDEC committee JC-15.1. Produces behavioral compact models that can predict the temperature of component packages at critical points such as the junction, case and board. New features include a faster, more accurate nonlinear optimizer, support for additional nodes, user access to setup parameters and the ability to create compact models from non-Flomerics simulation data.

Consists of a collection of "Smart Part" modules installed on a central web server. Users enter data describing the IC package through simple forms using a standard Web browser.

An advanced nonlinear optimization method reportedly provides more accurate Delphi compact models. The new algorithm automatically optimizes the area assigned to each node, eliminating the need for manual nodal partitioning. Provides a more flexible objective function that combines flux and junction temperature contributions. In addition to the top inner/outer and bottom inner/outer nodes supported in the past, the new version also supports up to two side nodes for all packages and up to four lead nodes for leaded packages.

Flomerics, flomerics.com

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