Multicore LF318 is a halide-free, no-clean, pin-testable, lead-free solder paste that promises broad process windows for printing and reflow. Developed to appeal to multinational manufacturers wishing to qualify a single solder paste with reliable, repeatable performance within the assembly environment.

Reportedly achieves a high degree of coalescence upon reflow even after 72 hours at 27° C and 80% RH, and in testing to IPC ANSI/J-STD-005 and JIS-Z-3284 standards displays excellent resistance to slump. Has low paste wastage - the result of superior tack life and an open time greater than 24 hr. - and resistance to component movement during high-speed placement, through its high initial tack force of 2.0g/mm².Suitable for reflow in air or nitrogen, said to display excellent solderability on a range of surface finishes, including Ni/Au, immersion Sn, immersion Ag and OSP copper. Soft, non-stick, colourless residues remain after reflow, easing visual inspection and permitting reliable in-circuit testing.

Available in lead-free alloys 96SC (SAC387) and 97SC (SAC305, and a tin-lead version.

Henkel, henkel.com

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