ALPHA CoolCap thermal protection device cools components and semiconductor packages during high-temperature lead-free reflow and rework processes.
 
Said to provide cost-effective protection without a substantial investment in process changes and redesign, while maintaining the high yield and throughput required by electronic assemblers. The reusable custom-fitted caps keep semiconductor packages below 245°C or 260°C and minimize temperature variation within packages from over 10°C down to 2-5°C, while minimizing warpage, popcorning and delamination.
 
Can be used in no-clean, water-soluble or RMA processes as a temporary heat sink that can be placed on components either by hand or with existing pick-and-place equipment.  No adhesive is required and no residue is left on boards or components. Can be designed to cool the package body, allowing reflow underneath, or to "overcool" - preventing reflow in cases such as adjacent packages during rework. 
 
Cookson Electronics Assembly Materials, alphametals.com

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