EASYLINE 8088 is a die bonder for sensor assembly. Applications include pressure sensors, accelerometers, gyroscopes and other components related to the automotive, biomedical and IT markets. Offers high-volume die bond technology at an attractive price - performance ratio for the sensor and micro assembly market.

Features high-speed air bearing pick-and-place system, closed-loop linear motor pick tool for unbeaten bond line thickness control and fully automatic wafer handling system. To match MEMS and sensor related demands, an active and precise theta control of the bond head is implemented.

Can handle substrates like lead frames, premolded lead frames and ceramics up to 4.5 x 4.5", great for sensor-related die bonding. Allows exact dispensing of epoxies and solder pastes. The closed-lopped linear motor pick tool provides active control of the placement height, for stable bond line thickness. An "open interface" (SMEMA) allows fast adaptation to third party systems or integration into a production line.

Front access to all major systems simplifies the operation. Footprint is 1m².

Alphasem, alphasem.com

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