The high-throughput IX-3000 is a Class 1 UV Excimer-based laser step and scan ablation system for micro-machining, drilling and laser processing.

The high-accuracy mask imaging system for large field of view (FOV) processing applications is also surrounded by a cleanroom enclosure with HEPA filtration.

Operates at 248 or 193nm UV wavelengths primarily; however, customer can choose different lasers, including: large-area patterning, microvia drilling, microelectronics micro-machining; general drilling; manufacture of inkjet nozzle arrays; flat panel displays, wafer-scale processing; sensors; microfluidics; and other applications, all with resolution down to 1 micron.

Optical resolution, repeatability and structural accuracies are sub-micron with 0.2 to 0.3 micron repeatability. Granite-based, vibration and thermal dampened for optimum stability.

Available with cassette-to-cassette wafer handling, panel-handling, robotics handling or tape and reel systems as options. Readily integrates with high-volume part handling systems.

J P Sercel Associates (JPSA), www.jpsalaser.com

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