The assembly of bare die in complex package configurations and/or with unique assembly processes is becoming more commonplace. Bare die are also being assembled together with a variety of other components and mechanical parts. Key applications driving this trend include remote sensing, distributed control, identification and 3-D assemblies.

To address the needs of these applications, Hover-Davis and Alphasem have agreed to work closely together to offer customers complete flexible die/component assembly solutions. For feeding bare die and flip chips, Hover-Davis will be providing Direct Die Feeders for integration into the Alphasem Flexline. The Flexline is an adaptable assembly platform capable of a handling a variety of components and processes. 

Hover-Davis, www.hoverdavis.com

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