KIC has expanded its library of solder paste process windows within the KIC 2000 software to 788. This number includes reflow and cure specs, as well as a host of new lead-free solder paste process windows.

 
The library is scheduled to be updated with new pastes every quarter, and is available for download to KIC 2000 platform users free of charge. With the addition of solder pastes to the library, the following dialog will be displayed on the Web site when a user clicks to download the file: "This release of the KIC 2000 Solder Paste Specs Library contains updated information for the following manufacturers: Almit, Avantec, Cobar, Indium, Kester, Koki, Loctite and Multicore." For paste manufacturers that are not listed above, KIC will attempt to provide updated information in the next release. If a solder paste is being used that is not listed in the Library, users can select the "Define Your Own Spec" option and manually enter the data that is given on the technical data sheet provided by that paste's manufacturer.
 
Each future update will contain the list of any manufacturer whose data has been changed/updated. This allows the user to know ahead of time whether they need download the file or not.
 
 
KIC, www.kic-thermal.com
 

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