FRANKLIN, MA -- Speedline Technologies will showcase various solutions and technologies in Booth 4D29 at Nepcon Thailand on June 16-19 in Bangkok.

Exhibits and demonstrations include:

The MPM AccuFlex stencil printer, suited for moderate volume high-mix printing. Combines accuracy and flexibility in a compact footprint. Offers a full range of options for future expansion. Designed for production of 8,000 boards per week with two or more product changeovers per shift, the system easily handles boards from 3 x 2" to 23 x 20" and is capable of printing 12-mil pitch devices with consistent accuracy. 

The accurate, flexible and configurable Camalot XyflexPro dispensing system features a calibration-free linear gantry drive system, small footprint and ability to meet any application need through easy-to-add options. Whether dispensing micro dots of silver epoxy, solder paste for high-frequency devices and wafer-level packages, adhesive for 0201 components, or underfill for flip-chip packages or flip- chip-on-board, the system provides the accuracy to maintain process control.

The MPM Gel-Flex Tooling System is a cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, is a true conformal board-support system.

Compressible gel provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. Available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.

Speedline Technologies, http://www.speedlinetech.com

 

 

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