X-Tek Revolution Provides New Angle on Inspection
X-Tek Systems will be exhibiting its Revolution inspection system at SEMICON West on July 11-15.
Offers a viewing angle of up to 75o, allowing for magnification up to 6000X at angles over all of the 16 x 16” (406 x 406 mm) manipulator scan area, for analysis of wafer bump inspection, BGA ball wetting, attachment, cracks and delaminations.
Features 160XI cable-free open x-ray tube, which offers sub-micron resolution in a stable and low-maintenance format, with easy-to-change extended life filaments. Positional accuracy is achieved through fast motors on all axes, to give precise feedback for high-speed, accurate inspection.
User-friendly InspectX software and is ergonomically designed for operating comfort, with both mouse and joystick control and an outsize viewing window.
X-Tek Systems, xtekxray.com
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