DES PLAINES, IL — Kester will highlight SE-CURE UT-10 TIM in booth 8802 at Semicon West. 

The lead-free, SMT-compatible, high-performance thermal interface material consists of a paste containing both fusible and non-fusible metals in a 100%-solids, thermosetting polymer matrix. Can be dispensed or stencil-printed and is processable on standard lead-free SMT reflow profiles. Can be used for attachment of power die to lead frames or ceramic or organic substrates. The fusible alloy is Sn96.5Ag3.0Cu0.5.

Features an advanced three-component composite system that leverages polymer and metals technology. The material costs less than silver-filled adhesives.

Reportedly provides higher performance than Ag-filled adhesives at lower material and overall process costs. Controlled-collapse bond line ensures repeatable assembly characteristics and thermal performance. In applications where over-molding is performed, it eliminates problems associated with solder squirting. The polymer component is compatible with epoxy-based over-molding chemistry.

Kester, kester.com

• Prev
• Next