A Mobile Device Rework (MDR) package with integrated solder paste dispenser has been developed to rework mobile phones, PDAs, gaming handhelds, multimedia portables, Bluetooth and WLAN equipment, memory cards, notebooks and portable medical equipment. The new package will be on display at booth 8715 at SEMICON West

The fully integrated rework system can dispense solder paste dots small enough for 0201 rework. Can also dispense additional materials including epoxy and underfill.

Equipped with a motorized placement module, WinCOMISS software controls bond force during placement and soldering.

Provides rework capability for the smallest of devices up to RF shield cans, and for the challenge of  extremely high-density packages.  The “cycle” includes device removal, residual solder clean-up, fresh paste dispense and component replacement. A fully automated version (Auto-MDR) is also available.

Finetech Inc., www.finetechusa.com

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