Tatsuta Develops Ultra-Thin Shielding for Flex
TOKYO -- Tatsuta System Electronics Co. released a new EMI shield film, SF PC-5000, formulated for flex interconnects, COF, hinge applications in cellular phones, digital camera modules and LCD drivers. Total thickness is 22 microns. Well suited for dynamic flex operations, also acts as a covercoat.
Base dielectric is a soft epoxy only 5 microns thick, covered with 0.1 to 0.15 microns of silver and 17 microns of anisotropic conductive Adhesive. Said to exhibit excellent thermal stability during reflow with no blistering or warpage and minimal shrinkage. Comes with a matte black finish, a 50-micron PET transfer film for handling and a 120-micro film for protection.
Further info.and samples available from FRP Services & Co.: (914) 868-4090 Ext. 110; kobayashi@frpusa.com
