BTU Int’l Announces Wafer Bump Reflow Line Upgrades
NORTH BILLERICA, MA --BTU International has announced a number of upgrades to its wafer bump reflow production line.
The addition of an integrated three-axes robot from Brooks Automation enhances wafer handling and the system's capability for 24x7 applications, helping to maximize equipment uptime.
A new, simplified control system that uses a single operator interface provides more precise and flexible control throughout the system, including the reflow oven and flux coater. The control system enables the use of 300-mm standards including E40, E84, E87, E90, E94 and standard SECSII/GEM interface.
Designed to be easily scalable for use in future 300-mm fabrication. Can be used as a 200-mm to 300-mm bridge tool with FOUP inserts; features Brooks Automation FixLOAD loadports for use with 300-mm FOUPs.
BTU International, www.btu.com
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