AL Series optical inspection and defect review system delivers wafer edge and bevel inspection.  Full bevel inspection allows user to see the top, side and bottom of the wafer from various angles using  continuous angle adjustment.  Detects particles, pits and residues that lead to hot spots on the front side, chips, cracks and scratches that cause wafer breakage, and edge bead removal issues harm the individual wafer and can result in equipment and wafer cross contamination.  Defect information and images are stored in a common defect format for tracking and yield analysis.

"A 300-mm wafer has 942 mm of edge, giving you nearly one meter of edge die on every wafer," said Greg Baker, COO. "Edge die yield remains one of the big challenges in IC manufacturing with a variety of edge defects contributing to loss. If edge defects are reduced, wafer yield improves. Olympus's new edge and bevel inspection technology enables semiconductor manufacturers to detect these defects early in the manufacturing process and track them through the process."

Perform a range of inspection and defect review tasks, including macro and micro inspection, automated image capture, operator or automated defect review, and automated defect classification.

Include a variety of visible light imaging methods using Universal Infinity Systems (UIS) corrected optics. Can integrate 248-nm Deep-UV Air Gap optics for optical resolution of 80 nm.   

Available with GEM and GEM300 factory automation software. A variety of SEMI compliant load ports (FOUP, FOSB, SMIF, open cassette) can be attached in various configurations (front, rear, or side load).

Olympus Integrated Technologies America, olympus-ita.com

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