WS330 is a compact wave soldering machine for small- and mid-size volumes in standard and lead-free technology. Solder width up to 330 mm and the universal pallet transport system allows for a variety of PCBs. Equipped with a dual-wave technology, allowing THT and SMD components to be soldered.

Includes full convection preheating, spray fluxing system and composite coated parts.

Said to offer small delta-T values, precise hot air flows and a closed loop.

Microprocessor-controlled temperature cycles ensure fast preheating. High temperature efficiency enables a shorter preheat zone

Coating of the solder pot and wave elements enables production with lead-free solder. The coating is applied after the complete pot is finished, eliminating possible problem areas. All parts in contact with the solder are coated (pot, pump, channel).

Available with spray or foam fluxer. Spray fluxing features automatic board detection.

Equipped with a universal palette transportation system based on an antistatic belt. Has ergonomic loading/unloading heights.

ESSEMTEC AG, essemtec.com

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