Leica Microsystems Launches 300-mm Macro Tool
Launched at the Semicon Europa show in April, two of the LDS3300 C models have already been delivered to the North American fab of a major semiconductor manufacturer. Additonal installations for this client are expected soon in European facilities.
“Conceived for perfect integration into automated fab lines, our new system combines micro and macro defect detection for all 300-mm wafer applications,” said Thomas Breser, strategic marketing & communications director. “This is an important part of why our client chose the LDS3300 C.”
As part of the automated macro inspection process, provides automated reticle and fuse inspection capabilities. High throughput (up to 130 wafers/hour) helps increase yield and reduce cost of ownership.
Focal plane analysis has high accuracy and efficiency in scanner focus calibration and monitoring, and scanner e-chuck flatness measurement and monitoring.
Leica Microsystems, leica-microsystems.com
