SensArray Corp. announced an Assembly and Test Business Unit to deliver process optimization tools specifically for backend semiconductor manufacturers. The unit currently markets six applications as well as custom control systems to ensure optimum performance and better yields during wafer bumping.

"Present instruments currently used to control processes such as solder reflow and curing polymer coatings have become inadequate due to their lack of accuracy and sufficient channels of data measurement and analysis," said Phil Marcoux, Assembly and Test manager. "SensArray is leveraging its reputation for leadership in process optimization tools for front end IC manufacturing by supplying a set of measurement and control solutions that provide temperature accuracy, stability and calibration for the backend market."

With process optimization tools and measurement systems, regular profiling can reveal potential process problems before manufacturers realize a reduction in yields, which necessitate high rework requirements. SensArray has created a system bundle from its current tools for measuring real time, in situ temperature in backend processes.

The bundle includes: Process Probe1935 thermocouple (TC)-instrumented wafer; Process Prob3 1630 TC-instrumented wafer; Process Probe Custom Reflow; PDA-based Thermal TRACK measurement systems; laptop-based Thermal MAP metrology systems; and the Intelligent Sensor Interface System (ISIS).

SensArray, www.sensarray.com

• Prev
• Next