Cookson Electronics Assembly Materials has launched ALPHA EF-10000, the latest addition to its lead-free no-clean wave solder flux technology. The high rosin, no-clean, alcohol-based product passes international reliability standards, including JIS, IPC and Bellcore, while reportedly providing broad process compatibility and excellent first pass yield in both lead-free and tin-lead wave soldering applications.
Said to deliver best-in-class top side hole fill on a variety of common plated through-hole sizes; is fully capable with SAC and eutectic tin-lead alloys. Resists micro solder ball formation.
“ALPHA EF-10000 flux passes the JIS, IPC and Bellcore electrical reliability standards enabling electronic assemblers to build strong, durable joints in both lead-free and tin-lead processes,” said Steve Brown, global product manager at CEAM.
Cookson Electronics Assembly Materials, alphametals.com