Essemtec Software Offers Process Control For Reflow
Published: 25 August 2005
by Staff
RO-CONTROL software combines important functions for process evaluation and process control for reflow ovens. It simulates temperature profiles with different oven settings and enables the comparison with a profile reference from the solder paste library. Controls the reflow oven and assures quality.
The effect of different oven settings to the reflow profile can be studied in advance and parameters can be optimized without tests. The simulation program calculates the reflow profile from the zone temperatures, the conveyor speed and a PCB constant.The simulated temperature profile can be compared with the guidelines of the solder paste manufacturer. The available solder paste library can be expanded by the user.
The real temperature profile on the PCB can be measured using two optional thermocouples. Measurements are shown graphically. For process analysis profile comparison the antecedent simulated profile and the solder paste reference can be superimposed.
ESSEMTEC AG, essemtec.com
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