Henkel Debuts Multicore MP218 Paste
Published: 07 September 2005
by Mike Buetow
Multicore MP218 halide-free, no-clean solder paste is optimized for SnPb processes yet compatible with Pb-free device finishes. Is comprised of similar raw materials, activators and other components as used in next generation Pb-free solders. Offers wider reflow capabilities to overcome wetting issues caused by the combination of SnPb solder and Pb-free device finishes.
Is designed to operate under elevated Pb-free temperatures (up to 260°C). Is said to have high humidity resistance. Anti-tombstoning formulation is designed to extend the liquidus time of solder during reflow, increasing the wetting window for each end of the component.
Press Releases
- Saki to Highlight Advanced Inspection Innovation at 39th Nepcon Japan
- ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
- NCMS Releases White Paper: “Artificial Intelligence to Improve Supply Chain Resilience Throughout American Manufacturing”
- E-tronix Expands Team with Strategic Hires to Strengthen Technical Solutions Support in 2025