EFD introduces SN89/SB10.5/CU0.5 high-temperature, lead-free solder paste with a solidus temperature of 242ºC, 22°C delta above SAC. May be used for multiple-step component assembly where the component will later be attached to a PCB using SAC alloy.
 
With the lead-free deadline rapidly approaching, an alloy with a higher reflow temperature is necessary.  Additional advantages include high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys and a pasty range of 21ºC from 263º to 242ºC. 
 
Available in all flux systems and alloy types II, III, IV and V. 
 
EFD, efdsolder.com

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