AIM to Highlight SN100C Pb-Free Alloy at ATE
Published: 22 September 2005
by Staff
AIM will highlight its lead-free soldering materials, including the SN100C lead-free alloy, in booth 5434 at AT Expo in Rosemont, IL. In addition, a live lead-free selective soldering demonstration with the alloy is in booth 5437.
SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel.
SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel.
The small amount of nickel modifies its behavior so that in wave soldering it exhibits fluidity comparable with tin-lead solder. Excess solder drains easily off the joint, so bridges and icicles are avoided. Provides smooth, bright, well-formed fillets which make inspection easy.
Does not contain silver or phosphorus, is less aggressive towards the copper of tracks and pads or the stainless steel components of soldering equipment. Has a low dross rate.
AIM, aimsolder.com
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