Customization options are available for 300L and 400L selective soldering machines. Features include combination mini-wave and full-wave soldering, dual pot systems, xy fluxers and endoscope process cameras. Additional options include custom nozzles, rotating landing tables, stamp soldering and batch conveyors. Both are compatible with lead-free alloys. 300L is the economical solution for selective soldering of through-hole components after reflow and includes bare board or mask grippers, internal spray or drop jet fluxers, and installation of various soldering nozzles ranging from 4 to 30 mm in diameter. The high-end 400L offers a three-stage inline system for a high-speed, automated soldering process.