AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.

Enables a tailored coefficient of thermal expansion, offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Eliminates the need for thermal interface stacking. 

Said to exhibit a high thermal conductivity for efficient thermal dissipation. Prevents the bowing and flexing of packaging and substrate material that can lead to failure. 
 

The net-shape fabrication process produces the composite material and fabricates the product geometry. Allows rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials. 
 

The unrestricted geometry enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The cast surface supports various identification methods including laser marking, paint, ink and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. Enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes.

CPS Corp., alsic.com