OmniFlex 10 reflow oven is said to feature advanced heating and cooling transfer technologies, energy efficient design concepts and reduced maintenance requirements.
 
Speedline will also mark the European launch of its XyflexPro dispensing platform and spotlight its recently released Accela stencil printer at the show.
 
The dispensing platform features an advanced composite gantry design structure and linear drive system using the latest in motion control drive technology. The platform has the structural rigidity and control needed to attain the high performance capabilities and speed demanded by challenging manufacturing requirements while providing flexibility to accommodate applications in both the SMT and semiconductor industries.
 
The printing system’s parallel processing technology is refocusing the measurement of printer performance from base cycle time to total throughput.  The system on display will have enhanced features such as a new software release, Grid-Lok and a barcode reader option for board-level SPC data and event tracking.
 
The company will also launch the next generation of its Vectra wave soldering system. The system features UltraFill nozzles, a High-Velocity Convection Topside preheat module and ServoJet fluxing technology. 
 
Speedline Technologies, speedlinetech.com
Booth A4 250

• Prev
• Next