LPKF MicroLine 350 Ci Laser System Depanels Assembled PCBs
Published: 28 November 2005
by Staff
Features higher cutting speeds for mechanical depaneling methods; requires no expensive tooling.
The laser technique leaves no residual dust on the PCBs and will not damage sensitive components. Cuts any contours while maintaining higher precision than mechanical routing systems. The non-contact and stress-free cutting process, with a very small beam diameter, allows components to be placed close to the edge of the board for optimum utilization of the panel.
Can be integrated in an existing SMD production line, or used as a stand-alone work station.
LPKF Laser & Electronics, lpkf.de
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