Circuits Assembly Online Magazine - Hover-Davis Presents DDf Ultra Direct Die Feeder

DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.

Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.

Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”

Hover-Davis, hoverdavis.com