The manual version of Fineplacer Lambda is used for sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V l. Can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system. 
 
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
 
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
 
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
 
Finetech Inc., finetechusa.com
Booth 1481

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