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Schott WLP Technology Packs Entire Wafers

Published: 26 January 2006
 by Staff
Until now, optical chips have been cut out of a silicon wafer and then placed individually into housings. However, the dimensions of these casings are several times the size of the chip itself.
 
Schott’s Thin-Glass Wafer-Level-Package with BGA on the backside concept aims to manufacture miniature opto-housings.
 
Instead of packaging individual chips, the technique “packs“ the more than 1000 chips that the entire wafer yields at the same time.
 
Production started at the Electronic Packaging business unit in Singapore last October. The company aims to manufacture approx. 3 million chips per month with its staff of 65 employees.

 
SCHOTT North America, us.schott.com
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