Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high-volume stencil printing applications with CSP lead pitches of 0.5 mm and 0.4 mm.  As lead-free manufacturing becomes the norm, the ability to reliably process finer pitched devices within Pb-free parameters will be vital. 
 
Is formulated to deliver low voiding in BGA joints. Said to offer performance over a range of reflow profiles and long abandon time capabilities, the paste gives assemblers the flexibility they require when running lead-free processes. The material provides tack force to resist component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers humidity resistance.  Soldering activity on a range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper enables lead-free production.
 
Produces safe residues, which eliminate the need for cleaning, and its post-reflow low-color residues simplify visual inspection . 
 
Classified as ROL0 to ANSI/J-STD-004. 
 
Henkel, electronics.henkel.com

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