Loctite 3549 is a high flow underfill formulated for use with advanced CSP and BGA packages. Is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing. 
 
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
 
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs.  Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
 
Henkel, electronics.henkel.com

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