Cookson Electronics’ ALPHA OM-338 Series solder pastes can enable a smooth transition to lead-free SMT assembly. Customers say this Pb-free solder paste can print as well or better than current Pb-bearing technology. It is said to deliver consistently uniform print deposit volume, thus overcoming print deposit volume variability. It also performs well in challenging applications where paste volume variability increases as print feature sizes become smaller. 

“The limiting factor in solder paste printability is the ratio of aperture wall area to the area of the aperture opening. When solder paste has more affinity for the walls of the stencil aperture than the pad being printed, you have a significant print failure mechanism,” said Mitch Holtzer, Global Products Manager for solder paste.  “ALPHA OM-338 Series has low print volume variability with .3 mm circles and .45 mm pitch qfp pads using 125 mil stencils, even with print speeds of 200 mm/sec. That performance can be reached using type 3 solder powder.”
 
Cookson Electronics Assembly Materials, cooksonelectronics.com

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