Almit Technology will debut a new Pb-free paste at Nepcon UK this April, created specifically for printing at up to four-times the normal printer excursion speed. LFM-48 TM HP solder paste reportedly enables increased productivity, allowing European assemblers to bid successfully against competitors in low labor cost countries.

The paste is said to exhibit good wetting, high definition printing with long screen and tack life. It is approved and adopted by major manufacturers worldwide for open blade printing and enclosed print head systems.

For through-hole assembly and rework, Almit has also introduced cored solder wire featuring 96.5%Sn-3%Ag-0.5%Cu alloy. KR-19SH RMA wire retains the benefits of the original product to deliver wetting, high reliability and low residue. It is available in diameters from 0.3 to 1.6 mm on 0.5Kg reels – and in selected sizes on anti-static Handy Reels.

Almit Technology Ltd., almit.com

Visit Stand C2 at Nepcon UK