Kester will provide lead-free resources, technologies and products during Nepcon China this week.
 
The company will feature numerous products from its Lead-Free Solutions (products and services) portfolio to help companies beat the July 1, 2006 RoHS Directive deadline. Featured products are EnviroMark 907 lead-free no-clean paste and its low-cost Ultrapure K100 lead-free bar solder alloy, along with  technical services to help manufacturers assemble lead-free. 
 
EM907 reportedly exceeds customers’ expectations for high-yield Pb-free manufacturing, and was designed for the higher thermal demands of assembling with higher melting temperature Pb-free alloys. Featuring a long stencil life, the solder paste is said to offer Pb-free joints that closely resemble those achieved with Sn/Pb solder paste.
 
K100 is a near-eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint. This improves joint reliability and virtually eliminates common defects such as icicling and bridging. The improved grain structure also results in completely filled and shinier solder joints than traditional lead-free alloy alternatives.
 
 
Kester, kester.com
Nepcon China booth 2E48http://www.kester.com

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