Circuits Assembly Online Magazine - Koh Young Adds KY8030 SPI System

Koy Young will introduce its KY8030 Solder Paste Inspection (SPI) system for the Chinese market during Nepcon Shanghai this week. Adding to the company’s portfolio of 3-D SPI equipment, this small footprint system offers a low cost of ownership. A dedicated Chinese GUI allows fast set-up and intuitive operation.

President and CEO Dr.Kwangill Koh said in a press release, “Test and Inspection is very cost sensitive, but vital for new process introduction. With the Chinese RoHS legislation, we believe that it will be inevitable for customers to use 3-D SPI during the Pb-free process introduction”.

3-D SPI Equipment delivers accuracy and repeatability for measurement of true paste height, area and volume at line speed. Strong SPC package contributes to better productivity and enhances the product by ensuring consistent solder paste volume.

Koh Young Technology, kohyoung.com

Nepcon Shanghai booth 1F15 (WKK)