Circuits Assembly Online Magazine - JPSA Ships Cassette-to-Cassette Wafer Processing Systems

JPSA has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These systems can process more than 80 wafers per hour, and are suited for a variety of materials such as: GaAs, silicon and sapphire.

Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.

IX-1100 is an industrial excimer workstation, a compact integrated UV processing system with a built-in high- power excimer laser. Features automated mask control, step and scan and high-resolution imaging and workpiece viewing using the Chromacel line. Optional modules include beam attenuators and homogenizers and dielectric laser masks.

IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC.

Available with optional SQL database connectivity. Typical applications include tracking of process data by part number.

JPSA, www.jpsalaser.com