Circuits Assembly Online Magazine - Finetech to Show Fineplacer CRS 10 at Nepcon East

Fineplacer CRS 10 compact rework system is designed for customers needing a fixed configuration. Said to have quick set up and easy operation. Most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large SMD boards. Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and connectors), RF-shields, shielding frame, flip-chip rework as well as customized applications.

Features a Plug-and-Work design, Vision Alignment System with stationary beam splitter, controlled z-height during reflow, proven soldering head technology, Pb-free compatible rework and an automated component place and lift-off function. Also equipped with a Controlled Mixed Soldering System (COMISS) reflow module for top heating and full-area bottom heating.

High accuracy (better than 10 µm placement accuracy) allows use with components with pitches down to 100 µm. Large field of view can align large components, e.g. super BGAs with side lengths of up to 45 mm, without additional optics.

Finetech, finetechusa.com

Nepcon East booth 2001