ENDICOTT, NY— Endicott Interconnect Technologies has been awarded several new contracts for fabrication of wire bond PBGA substrates resulting from alliances with Silicon Valley-based companies Singulated Technology and CORWIL Technology Corp. 

EI will provide wire bond PBGA substrates per Singulated Technology’s design specifications and CORWIL will provide the module assembly. End customers for these semiconductor modules use them in military, commercial and wireless electronics applications.  
 
“This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,” said James J. McNamara Jr., president and CEO of EI. “The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL, and to provide substrates that add differentiating value.”