MINNEAPOLIS, MN – As part of SMTA International – co-located with ATExpo in September in Rosemont, IL – the SMTA has organized its Emerging Technologies Summit to address the latest trends in electronics manufacturing and assembly. The ET Summit, which consists of three paper sessions and a concluding panel discussion, will take place on Sept. 25.

The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip-Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.

The next session, Wireless Technology, will feature papers on Emerging Opportunities and Challenges for High Frequency Broadband Communications, Connecting the Unconnected – Broadband Wireless Access Technologies, and Network, WiFi, WiMax, WiMedia, WiMe? What Wireless Standards Can Bring to Sensing and Controls.

The last session, Using RFID to Add Value to Your Products and Services, will feature a presentation and demonstration of high frequency and ultra high frequency technology and their application in PCB product environments.

Moderated by Reza Ghaffarian, Ph.D., of Jet Propulsion Laboratory, the panel discussion will feature key industry participants who will respond to audience and moderator questions.

For event registration, visit smta.org/smtai.

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