PHOENIX, AZ – FlipChip International and Engent have formed an alliance to accelerate the development and deployment of 3-D Wafer Level CSP (WLCSP) technologies for highly integrated stacked die packaging applications. This technology may enable packaging solutions that are quicker to market and lower cost than system-on-chip alternatives.

The partnership couples FCI’s high-volume, ultra-fine pitch wafer bumping capabilities and 2-D Wafer Level CSP package portfolio with Engent’s abilities in advanced surface-mount and flip-chip assembly technology. The flexible technology platform emerging from this partnership supports a range of ultra-high volume IC packaging applications including Silicon on Silicon, GaAs on Silicon and SiGe on Silicon as well as 3-D integration of emerging integrated passive device technologies and MEMS devices for System in a Stack solutions.