A-Tek, a distribution company based out of Fort Collins, CO, will introduce Asscon Vapor Phase Technology to the North American market.
 
Vapor phase soldering allows high levels of thermal control and low delta Ts across complex circuits. The use of an inert liquid with a boiling point at or slightly above the desired soldering temperature creates a vapor blanket that, through the process of condensation onto the circuit, heats the circuit homogeneously without elevated ramp rates or differentials between large and small components. The phase change (condensation) at the surface of the solder piece lasts until the assembly has reached the temperature of the vapor. Due to the high vapor density and the liquid film created at the interface of the Vapor blanket and the circuit as a result of condensation, the complete heating takes place in an oxygen-free environment. The transferred quantity of heat is linear to the supplied heating energy making control simple and energy efficiency high.
 
Batch (stand alone) and inline systems are available. Batch machines feature pre-heating, soldering, drying and cooling. The loading of the machine and starting of the soldering process is done manually. May be additionally equipped with an automation system.
 
Inline-condensation-reflow-soldering machines close the gap between the automatic batch units and the convection-inline-machines for large mass production series. Using the temperature gradient control and the automatic solder-temperature identification, designed as classical inline machine with separate conveyors for loading, pre-heating and cooling of the PCBs arranged in the direction of the process, these machines may produce very high levels of productivity. 
 
Have standard SMEMA interfaces, can be integrated into automatic inline production.
 
The main application is the production of complex high-density boards or complicated components, high-mass circuits and very large back planes. Due to the favorable efficiency for the condensation heat-transfer, the machine requires only a very moderate energy supply. Average energy consumption is low even when operating at full capacity.
 
As the respective process vapors create an oxygen-free atmosphere in the soldering-zone, the machine does not require any additional protective gases, e.g. nitrogen. With its integrated circulating cooling system for the necessary cooling water, the machine is independent of an external water supply.
 

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