FLIP Solder Bath for lead-free reflow soldering features linear induction pumping technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming’s left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in selective soldering systems.            
 
Features advantages over other solder bath systems, including less solder used (300 kg, instead of 450 kg) and less solder dross (7 kg vs. 15 kg), after 8 hours of operation.This results in less waste. This feature uses one third less solder for cost savings. Offers ease of maintenance — open space to access inside bath – and easier nozzle cleaning and maintenance. Improved machine reliability and up time is realized — no motors, impeller shafts or belts. Said to feature a quieter, more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is eliminated and a quicker response results.
 
Tamura H.A. Machinery, tamura-ha.com

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