Typical applications include hard disk drives, USB controllers and Wireless LAN. The small size and weight, along with thermal and electrical performance, make the MLF package good for handheld portable applications, or other applications where size, weight and package performance are required issues.
 
Benefits include:

· Small size (reduce package footprint by 50% and improve RF performance) and weight
· Standard leadframe process flow and equipment
· Excellent thermal and electrical performance
· 0.6 to 1.5 mm maximum height
· 4 to 164 I/O
· 1 to 12 mm body size
· Thin profile and superior die to body size ratio

· Lead-free/green
· Flexible designs and high yields.
 

Practical Components is the exclusive distributor of mechanical samples ¾ or “dummy components” ¾ for Amkor Technology.
 

Practical Components Inc., www.practicalcomponents.com