Circuits Assembly Online Magazine - AGI Produces Titanium Selective Solder Pallet

AGI Corp. is producing titanium selective solder pallets for wave soldering applications, including PCBs with PTH components in close proximity to bottom side SMDs. Machining titanium vs. composites achieves ‘seal walls’ down to .020” thick (and.015” over short distances). Other benefits: no sagging during soldering and thinner floor thickness which reduces the “z” height solder must travel.

Based upon machining a single piece of titanium to match the PCB and incorporating that into a composite pallet frame. Does not use small titanium inserts screwed to the pallet, which avoids leaking, alignment and thermal mismatch. Composite frame runs cool, so it is easier to handle or convey after soldering.