SHELLCASE CF is a wafer-level technology for optical components integrated into electronic products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.

Suitable for image sensors, certain types of MEMS and other optical devices, it protects components from contamination from the initial stage of processing and is compatible with conventional Chip-on-Board (COB) assembly processes.

An immediate application is for CMOS and CCD image sensors used in camera phones. Said to provide up to 40% improvement in yield over existing COB technology. This is realized through the protection of the sensor's active area from contamination and the ability to perform wafer-level image testing prior to module assembly, both of which improve camera module yield and reduce overall cost.

Uses existing wire-bond assembly infrastructure and processes, minimizing the hurdles to rapid adoption.

Unlike COB technology, it encapsulates the image sensor, MEMS or other optical device with a glass cover that is elevated from the silicon surface using cavity walls. The cover design leaves the image sensor bond pads exposed allowing for standard wire-bond assembly. The protected die is then singulated and mounted to the board using standard die attach processes. Provides the flexibility to perform optical testing at the most favorable point of the assembly flow, as defined by their specific requirements and manufacturing environment.

Tessera, tessera.com

SEMICON West, Booth 8622