Disposable Flextac stencils are an easy, reliable method for stencil printing solder paste on individual BGA component sites for rework. An adhesive side attaches temporarily to the PCB, preventing misalignment and solder paste smearing. Are inexpensive and disposable, help users keep Pb-bearing and Pb-free soldering materials separate, preventing cross-contamination. Are RoHS compliant.
 
Are part of a complete BGA stencil kit that includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades.
 
Are laser cut for correct aperture size from high quality, anti-static polymer film with a residue-free adhesive backing. No tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when solder paste is applied. Easy to use and leave no residue on the board surface.

Can be repositioned. The side tabs also serve as solder dams preventing solder paste overspill. Since the residue-free adhesive seals around each BGA pad, one may make as many passes with the squeege as needed to ensure proper aperture filling. The stencil is then peeled off, leaving a perfect deposit of solder on each pad. Disposable, but can be used several times.
 
CircuitMedic, CircuitMedic.com

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